Morningstar

Wolfspeed Unveils Foundation for Next‑Generation AI Data Center Advanced Packaging Leveraging 300mm Silicon Carbide Technology

Patent-pending innovations deliver scalable materials building blocks for advanced AI and high-performance computing packaging solutions Wolfspeed, Inc. (NYSE: WOLF), a global leader in silicon ...

Intel is in talks with Google and Amazon to power AI chips with new packaging tech

Packaging has shifted from a back-end afterthought to the center of Intel's manufacturing strategy as AI workloads push ...
DIGITIMES

CoWoS capacity emerges as AI bottleneck as TSMC’s advanced packaging grows at 80% CAGR

Global advanced packaging capacity is currently in severe shortage. Nvidia has already reserved most of TSMC's leading-edge ...

Intel reportedly in talks with Google and Amazon over advanced packaging — major customers could take advantage of EMIB-T later this year

Intel is understood to be in active talks with Google and Amazon to provide advanced chip packaging services for their custom ...

AI arms race triggers $143 billion explosion in chip gear spending

Wafer fab equipment (WFE) spending continued its upward trajectory in 2025, underscoring the semiconductor industry's shift ...

Intel is going all-in on advanced chip packaging

Then, in January 2024, the dormant fab was booted up again. Intel funneled billions into the facility, including $500 million ...
AOL

Advanced Packaging Is Bringing Sexy Back To AI Investing

Mon, February 16, 2026 at 8:20 PM UTC Our AI Investor Podcast hosts, Eric Bleeker and Austin Smith, have been counting down 12 trends they believe AI investors will want to keep an eye on in 2026.
Business Wire

Wolfspeed Unveils Foundation for Next‑Generation AI Data Center Advanced Packaging Leveraging 300mm Silicon Carbide Technology

DURHAM, N.C.--(BUSINESS WIRE)--Wolfspeed, Inc. (NYSE: WOLF), a global leader in silicon carbide technology, today announced that its 300mm silicon carbide (SiC) technology platform could serve as a ...