TSMC has spent years guarding its most advanced chip packaging technology, building out capacity internally and keeping the ...

Terence Gan, Executive Director of Singapore's A*STAR Institute of Microelectronics (A*STAR IME), delivered a confident address at the 2025 Advanced Packaging Developers Conference (APDC), unveiling ...

FUJIFILM Corporation announced today that it will present new semiconductor packaging research findings and exhibit its ZEMATES1 product line of photosensitive insulating materials, including ...

KLA (NASDAQ:KLAC) is seeing stronger momentum across semiconductor equipment markets than it expected earlier in the year, ...

The focus has been on Intel Foundry's ability to compete on fab process nodes. But advanced packaging is the foundation on which it is building its success.

Fabrinet (NYSE: FN), a leading provider of advanced optical packaging and precision optical, electro-mechanical and electronic manufacturing services to original equipment manufacturers of complex ...

Nvidia’s CEO Jensen Huang has made waves by saying that his company’s most advanced artificial intelligence (AI) chip, Blackwell, will transition from CowoS-S to CoWoS-L advanced packaging technology.

It’s no surprise to Plastics Today readers that the focus on plastics, packaging and the environment has accelerated. However, what is newsworthy are the emerging approaches to addressing these ...

The two-day event to deliver a robust conference, adjacent to renowned packaging event WestPack, to advance the multi-billion-dollar cannabis packaging industry. ANAHEIM, Calif.--(BUSINESS WIRE)--The ...

Chip packaging has expanded from its conventional definition of providing protection and I/O for a discrete chip to encompassing a growing number of schemes for interconnecting multiple types of chips ...

Advanced packaging mechanisms play a vital role in reducing food waste and ensuring the maintenance of quality during storage. An incredible challenge faced by the food industry is the development of ...