Apple is expected to use TSMC's new 2nm process and SoIC-X (System on Integrated Chip) advanced packaging technology in the second half of 2025, according to new reports. AMD was the first to adopt ...

TL;DR: Apple and Bitmain will lead demand for TSMC's cutting-edge 2nm process node in 2026, with TSMC ramping capacity to 60,000 wafers monthly by Q4. NVIDIA will adopt TSMC's 3nm node for Rubin AI ...

The A20 chip that will be used in the iPhone 18 could be packaged with a new tech that will give Apple more configuration options, while still being as small as possible. Apple's chips, produced by ...

Apple is gearing up for a significant upgrade across its product line with the introduction of TSMC’s next-generation 3nm processors, namely the M4 and A18 chips. Reports from the Economic Daily News ...

Apple's imminent M5 Pro and M5 Max chips will run cooler and faster than ever before, as a year-old rumor about the way Apple Silicon chips are packaged resurfaces. Apple is anticipated to bring out ...

Apple has begun mass production of its next-generation M5 series chips for key products such as the next-generation Mac and iPad, according to the Korean media outlet ETNEWS. The M5 lineup includes ...

Apple eliminated plastic from all packaging and launched the MacBook Neo with 60% recycled content — its most sustainable ...

New developments include removing plastic from packaging and using 100 percent recycled cobalt in Apple-designed batteries.

Apple hit record recycled-material use, got rid of plastic packaging, saved water and more, its latest Environmental Progress ...