Semiconductor Engineering

Back-End Packaging And Test: From Lessons Learned To Future Innovations

The semiconductor industry is a hallmark of technological innovation, evolving rapidly to meet the demands of an increasingly digital world. At its core, semiconductor manufacturing involves two main ...
Detroit Free Press

OpenLight and TFC Advance Silicon Photonics Back End Integration Supporting up to 400G Data Rates on TGV Substrate

– New evaluation board for a 400G EAM, based on OpenLight’s heterogeneous integration of InP-on-Si process, is available for testing, and includes a modulator driver – Evaluation card is designed and ...
Business Wire

Shin-Etsu Chemical: Developing Equipment to Manufacture Semiconductor Package Substrates for the Back End Process and Pursuing a New Manufacturing Method

TOKYO--(BUSINESS WIRE)--Shin-Etsu Chemical Co., Ltd. (TOKYO: 4063) (Head Office: Tokyo; President: Yasuhiko Saitoh; hereinafter, “Shin-Etsu Chemical”) has developed equipment to manufacture ...
Digi Times

Fujifilm increases back-end process materials investment to drive growth

Fujifilm announced its plan to strengthen its business in materials for semiconductor back-end processes at a semiconductor materials business briefing held in Tokyo on July 15, 2025. The company aims ...
Semiconductor Engineering

Front-End Technologies Are The New Back-End Tools: Using Picosecond Ultrasonics Technology For AI Packages, Part 1

If you are a part of the semiconductor industry or simply someone interested in the field, you have likely heard what has become a common refrain: the back-end of the process is becoming more like the ...