Oyster Bay, N.Y. – Mill-Max's ball grid array socket/adapter systems can socket both BGA devices and interconnecting circuit boards. BGA socket/adapters provide a high-density and low-profile ...

Ironwood Electronics has unveiled a new socket for testing ball grid array (BGA) devices; it uses a compression screw to apply downward pressure and thus allows the device to conveniently interconnect ...

Playing a crucial interconnect role in integrated circuits and semiconductor testing, test sockets, aka package probes, serve the role of connecting a device and its tester. IC sockets are categorized ...

Serving the role of connecting a device and its tester, test sockets—also known as package probes—play a crucial interconnect role in integrated circuits (IC), and therefore the greater field of ...