Business Wire

Cadence Expands Collaboration with Samsung Foundry, Providing Differentiated Reference Flows Based on the Integrity 3D-IC Platform

Companies advance multi-die planning and implementation, leveraging Cadence’s Integrity 3D-IC platform, the industry’s only unified platform that combines system planning, packaging and system-level ...
Nasdaq

Cadence Integrity 3D-IC Platform Supports TSMC 3DFabric™ Technologies for Advanced Multi-Chiplet Designs

The Cadence 3D-IC solution centers on the Integrity 3D-IC platform, which provides integrated planning, implementation and system analysis to optimize PPA for multi-chiplet systems The Tempus Timing ...
Design-Reuse

Cadence Delivers New Design Flows Based on the Integrity 3D-IC Platform in Support of TSMC 3Dbloxâ„¢ Standard

SAN JOSE, Calif.— April 26, 2023-- Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced new design flows based on the Cadence ® Integrity ™ 3D-IC platform to support the TSMC 3Dblox ™ standard ...
VentureBeat

TSMC and Cadence Collaborate to Deliver AI-Driven Advanced-Node Design Flows, Silicon-Proven IP and 3D-IC Solutions

Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it is collaborating with TSMC to enhance productivity and optimize product performance for AI-driven advanced-node designs and 3D-ICs.