Square-Foot Lancaster, PA., Facility Enables High-Volume Production of Single- and Two-Phase Cold Plates for AI and High-Density Computing LANCASTER, Pa., May 19, 2026 /PRNewswire/ -- ACT, Advanced ...
New 3D-printed copper technology offers a high-efficiency solution to the data center power crisis. University of Illinois Urbana-Champaign researchers developed a computer-chip-cooling technology by ...
BOCA RATON, Fla.--(BUSINESS WIRE)--Today, Boyd announced it has delivered five million liquid cold plates to hyperscalers, essential technology for Artificial Intelligence (AI) processor liquid ...
Mechanical engineers have designed a more effective and energy-efficient technology for cooling computer chips. Publishing May 7 in the Cell Press journal Cell Reports Physical Science, the ...
http://www.lytron.comAs electronic manufacturers strive to design and build higher-power electronic components and subsystems, they continue the move toward more ...
Breakthrough cooling design: University of Illinois researchers created optimized copper cold plates that dramatically improve heat transfer and reduce pumping power. Massive energy savings: The ...
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