The company, along with others, is pursuing a new paradigm for cramming more transistors on chips—building up.

Inside computer chips are billions of tiny transistors made from silicon. But the material is approaching its limits. In an effort to build smaller, more capable devices, researchers are exploring how ...

As traditional chip miniaturization slows, researchers have found a way to pack more computing power into the same space by stacking silicon circuits in multiple layers. The new process uses ...

In recent years, computer chip performance has bumped up against the physical limitations of the space available on integrated circuits.

The global semiconductor market is approaching US$1 trillion in annual sales, driven by growing demand for faster computers, smarter AI systems and more powerful electronic devices. Singapore, which ...

IBM's latest chip packs in twice as many transistors as the current state-of-the-art chip by adding a second layer of silicon ...

IBM's NanoStack architecture has led to transistors that deliver 50% better performance and 70% less energy versus today's ...

Forward-looking: For years, the chip industry has chased better performance by shrinking transistors and squeezing more of them onto a flat slice of silicon. That strategy is running into hard limits.

The big picture: Apple's latest manufacturing push is focused not on finished devices, but on the engineering layers that underpin them. In the desert north of Phoenix, at silicon fabrication plants ...