Tech Xplore on MSN

Photonic chip packaging can withstand extreme environments

Researchers at the National Institute of Standards and Technology (NIST) have developed a new way to package photonic ...
SDxCentral

NIST scientists crack method to bulletproof photonic chips against radiation, heat

Researchers at the National Institute of Standards and Technology (NIST) achieved a breakthrough in the development of ...
Morning Overview on MSN

Laser sealing could replace glue in paper packaging, researchers say

Laser technology could eliminate the need for adhesive glue in paper packaging, according to peer-reviewed research that has ...
MacRumors

Patent Applications Reveal Apple's Research Into 3D Chip Packaging

Apple's persistent quest for better performance, longer battery life, and slimmer form factors appears to be driving its research into advanced chip packaging technologies. So-called "2.5D" and "3D" ...
Electronic Design

Chip Packaging Part 2 - Introduction to IC Packaging

Dr. Navid Asadi’s group examines chip packaging methods such as system-in-package (SIP). This is the second of a mutlipart series on chip packaging technologies. Peter (Chengjie) Xi is currently a ...
Forbes

Six Ways Technology Can Help You Craft Better Packaging

The smart use of technology can improve your packaging, helping to give you an edge in the competitive market. By using modern technology rather than only using traditional packaging methods, you can ...