Arteris, Inc. has announced the launch of Magillem Packaging, a new software aimed at simplifying and accelerating the chip design process, particularly for advanced technologies in AI and edge ...

As semiconductor packaging technologies evolve, advanced methods like 2.5D and 3D Cu-to-Cu hybrid bonding are essential for achieving higher performance and power efficiency. However, manufacturing ...

Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...

Semiconductor manufacturing faces a new bottleneck. See how advanced packaging and laser-based tooling fix back-end supply chains.

The focus has been on Intel Foundry's ability to compete on fab process nodes. But advanced packaging is the foundation on which it is building its success.

Korea University of Technology and Education (KOREATECH) will receive 10 billion won in government funding to establish ...

Designing energy-efficient systems that meet the high bandwidth demands of high-performance computing (HPC) involves key trends in silicon technology: increasing transistor density, enhancing memory ...

Companies to collaborate on R&D to accelerate introduction of advanced packaging technologies for next-generation AI chips and systems ...

Led by Professor Tony Feng Shien-Ping from the Department of Systems Engineering at CityUHK, the research team developed a novel material to address the complex metallisation challenges in the ...

As countries race to secure semiconductor supply chains, UST's Gilroy Mathew says India's biggest opportunity lies in chip ...

Across Europe, many of us have grown accustomed to a model where semiconductor products, subassemblies and components are sourced from the Far East almost by default. The rationale has always been ...

FUJIFILM Corporation announced today that it will present new semiconductor packaging research findings and exhibit its ZEMATES 1 product line of photosensitive insulating materials, including ...