WAVIA configurable architecture. Module-down (LGA) as an alternative to chip-down; slotted also available. AIRETOS E92 brings Wi-Fi 7 to the embedded edge on the Qualcomm Dragonwing NPro 7 Platform, ...

NXP Semiconductors has claimed the industry’s first top-side cooling solution for RF power, which reduces the thickness and weight of 5G radios by more than 20 percent. The new family of top-side ...

TE Connectivity recently unveiled a new series of NanoRF modules and contacts that the company claims provide twice the density of standard VITA 67 RF modules for VPX embedded computing applications.

US-based Master Electronics has added RF modules to its offering with the signing of French RF module specialist, Insight SIP. The distributor is based in Phoenix, Arizona but ships worldwide as ...

No audio available for this content. TE Connectivity’s high-frequency nanominiature contact doubles density, reduces packaging. TE Connectivity, a connectivity and sensors company, has released new ...

The above button links to Coinbase. Yahoo Finance is not a broker-dealer or investment adviser and does not offer securities or cryptocurrencies for sale or facilitate trading. Coinbase pays us for ...

GREENSBORO, N.C.--(BUSINESS WIRE)--Guerrilla RF, Inc. (OTCQX: GUER) today announced that its high-efficiency GRF5509 4-watt power amplifier was selected by Impinj (NASDAQ: PI) for use in their ...

With the exception of the iPhone, Apple's products largely lack technology to provide ubiquitous access to the outside world while on the go. However, a new proposal from the company would attempt to ...

One of the most complex parts of enabling 5G is mmWave frequencies and the antennas and front-ends that control them. MmWave technologies have never been used for mobile cellular communications before ...

Main challenges facing RF designers. Design issues regarding PCBs, 5G, and regulations. Difficulties in finding RF engineering talent. Having been involved in developing products in virtually every ...

This is the next evolution of the company's high-performance RF interconnects for embedded computing systems. This update improved the alignment of connectors within modules and reliability, ensuring ...