AI plays a role in improving defect capture rate and distinguishing between yield-killing and nuisance defects. New developments in wafer edge inspection are proving essential to bonded wafer yields.
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AI-based model measures atomic defects in materials
In biology, defects are generally bad. But in materials science, defects can be intentionally tuned to give materials useful new properties. Today, atomic-scale defects are carefully introduced during ...
A new model measures defects that can be leveraged to improve materials' mechanical strength, heat transfer, and energy-conversion efficiency. (Nanowerk News) In biology, defects are generally bad.
Photo-induced force microscopy (PiFM) is a sophisticated nanoscale characterization approach that combines the elevated spatial resolution of atomic force microscopy (AFM) with infrared (IR) ...
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