As semiconductor devices continue to advance, the demand for reliable, high-performance test sockets has never been greater. Yet, traditional socket design validation methods—such as per-pin ...
This article is adapted from a presentation at TestConX, March 5-8, 2023, Mesa, AZ, by Vijayakumar Thangamariappan, Nidhi Agrawal, Jason Kim, Constantinos Xanthopoulos, Ira Leventhal, and Ken Butler, ...
TL;DR: AMD's next-generation AM6 socket will support Zen 7 processors with 2100 pins, a 22% increase in pin density over AM5, while maintaining the same size. This enables higher power delivery ...
Featuring a pin-to-pin spacing of 0.70 in. (1,778 mm), the SMT series 117, 127, 217, and 227 shrinkDIP sockets offer more pin connections per PCB than the standard 0.100-in.-pitch patterns. The ...
Ironwood Electronics has unveiled a new socket for testing ball grid array (BGA) devices; it uses a compression screw to apply downward pressure and thus allows the device to conveniently interconnect ...
Series 700, 0518, and 0501 RoHS-compliant sockets are specifically designed for high-pin-count or off-centered components for socketing DIPs with nonstandard row-to-row dimensions and elevating ...
Altech Corporation, a provider of industrial automation solutions, has added 60 A plugs and sockets to its family of IEC ...
The company’s latest board-to-board socket adapter for 352-pin BGA, 1-mm pitch, 27 mm x 27 mm devices consists of two modules: a female socket module and a male pin module. The female socket is built ...
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