Flip chip packaging connects chips directly to boards using solder bumps, skipping the old wire bonding method for a more ...

Solder paste is commonly used in the semiconductor packaging to connect chips and pads. Through printing, dispensing, and ...

The laser is based on a phenomenon discovered during the past century, and laser technology became real and concrete at the beginning of the 1960s. In less than 50 years, it has become the basis for ...

Employing advanced furnace profiling and soldering techniques with a variety of solder materials, a soldering process from packaging manufacturer Thunderline-Z (Hampstead, NH) promises to speed ...

Soldering irons, solder extractors and other equipment that comes in direct electrical contact with sensitive components can inject significant energy into these devices. Specifically, metal-to-metal ...

With the aim of making micro-electromechanical systems (MEMS) even more powerful in the future, researchers at the Fraunhofer Institute for Laser Technology (ILT) in Aachen have developed a ...