Sawnics announced a process design kit (PDK) based on Soitec’s Connect piezo-on-insulator (POI) substrates to accelerate RF filter design for 5G smartphones. The South Korean foundry, with expertise ...

Silicides — alloys of silicon and metals long used in microelectronics — are now being explored again for quantum hardware. But their use faces a critical challenge: achieving phase purity, since some ...

The flexible display's substrate is critical to e-paper's and e-ink's development. Many different types of materials are under investigation, including glass, plastic, polymer films, and metallic ...

Why co-optimization is needed when designing 2.5D and 3D chips. The tools provided by Siemens for 2.5D and 3D chip design and packaging. The latest high-performance chips often employ 2.5D and 3D chip ...

IC packaging has come into its own, where once traditional packaging was a “necessary evil,” today’s packaging can add significant value. There is an increase in functional density and flexibility by ...

SANTA CLARA, Calif.--(BUSINESS WIRE)--TSMC (TSE: 2330, NYSE: TSM) today announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform ® (OIP) 3DFabric Alliance at ...

Antenna packaging methodologies have evolved significantly to counter the escalating signal attenuation in high-frequency communications like 5G mmWave and anticipated 6G networks. Benchmark of ...

Multimaterial molding is supposed to take advantage of the efficiencies in forming two different materials into a single molded part. However, one firm’s planned production of a thermocontroller got ...

Antenna packaging methodologies have evolved significantly to counter the escalating signal attenuation in high-frequency communications like 5G mmWave and anticipated 6G networks. Previously, ...