The world’s largest foundry (semiconductor contract manufacturing) company, Taiwan Semiconductor Manufacturing Co. (TSMC), ...

TSMC is expecting to start production of 3nm wafers at its second Japanese chip fab in 2028. The timeline was confirmed in a Taiwanese government filing this week, a month after the chipmaker’s CEO ...

The move not only strengthens Japan’s position in the semiconductor sector, but also shows that chip competition is ...

This surge is attributed to a strategic shift in capacity toward High Bandwidth Memory (HBM) for AI applications, which is constricting the supply of standard DRAM. Looking further ahead, Nvidia's ...

TL;DR: TSMC will begin production of its next-generation A16 (1.6nm) process in 2027, with NVIDIA as the first customer, while Apple plans to skip A16 for the A14 (1.4nm) node. TSMC is expanding ...

More details are emerging about TSMC's massive investment in chip manufacturing on U.S. soil, which now reportedly includes ...

By Wen-Yee Lee TAIPEI, April 1 (Reuters) - TSMC, the world's largest contract chipmaker, is expected to launch equipment ...

In a nutshell: TSMC's 2nm manufacturing process is in development, and the world's largest semiconductor manufacturer is said to have secured orders from around 15 customers for N2. But companies such ...

The Taiwanese chipmaker outlines an advanced manufacturing timeline and capacity for its second Japan facility.

With TSMC’s CoPoS pilot line set for completion by mid-year, the semiconductor industry broadly expects volume production to ...