Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...
The simulation tracks a satellite's surface and internal temperature changes as it orbits Earth, considering varying thermal inputs from sunlight and Earth's shadow. Monte Carlo radiation modeling ...
In an era where artificial intelligence, autonomous vehicles, and high-performance computing push the boundaries of semiconductor technology, the thermal management of 2.5D and 3D integrated circuits ...
The figure shows the evolution of the microstructure of the melt pool under the influence of the simulated transient temperature field. Nucleated grains are represented in pink-purple plots, while ...
As electronic devices become increasingly miniaturized, heat management at the nanoscale emerges as a challenge, especially for devices operating in sub-microns. Traditional heat conduction models ...
The electronics industry exists in a continuous state of evolution. The world’s biggest companies are either launching new products, or refining and improving existing ones. In keeping with consumer ...
Flexcompute, the physics company, and Northrop Grumman have developed a foundational AI infrastructure powered by NVIDIA ...
Rohm Semiconductor has added a new thermal analysis function its Solution Simulator, enabling automotive and industrial circuit and system designers to verify power device and driver IC thermal issues ...
How in-house-developed and third-party general-purpose simulation tools are limited to a few expert users and aren’t easily shareable. How multiphysics simulation of subsystems can result in an ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results