Intel’s EMIB packaging gains AI customer interest as demand rises and TSMC CoWoS supply constraints push companies toward alternatives.

The semiconductor industry is undergoing a profound shift in packaging technologies to ones that rely on close collaboration among multiple stakeholders to solve intricate, multi-faceted, and ...

PTAG to acquire Construct-X, uniting leaders in AWP and digital project delivery to transform industrial capital projects through innovation and collaboration. PTAG and Construct-X, bringing together ...

98% of megaprojects face cost overruns or delays, costing the U.S. construction industry $280 billion annually. On the latest Disruption Interruption episode, Olfa Hamdi, CEO of Concord Project ...

Advanced packaging technology continues to make waves this year after being a prominent highlight in 2023 and is closely tied to the fortunes of a new semiconductor industry star: chiplets. IDTechEx’s ...

Nvidia’s CEO Jensen Huang has made waves by saying that his company’s most advanced artificial intelligence (AI) chip, Blackwell, will transition from CowoS-S to CoWoS-L advanced packaging technology.

Advanced packaging has become a focal point for innovation as the semiconductor industry continues to push for increased transistor density and better performance. But the pace of change is ...

GlobalFoundries has signed a Memorandum of Understanding with Singapore's Agency for Science, Technology and Research (A*STAR) to enhance its advanced packaging capabilities in response to the growing ...

TORONTO, April 15, 2025 /PRNewswire/ - PTAG Inc. ("PTAG") and Intelligent Construction Experts, LLC, doing business as Construct-X ("Construct-X"), are pleased to announce that they have entered into ...