The hybrid-composite rear load floor uses unidirectional (UD) thermoplastic tapes plus direct-long-fiber thermoplastic (D-LFT) composites. Thermoplastic tapes provided high stiffness/strength in a ...

Recycling plastic at home using 3D printed molds is relatively accessible these days, but if you do not wish to invest a lot ...

Today’s fan-out wafer-level packaging (FOWLP) processes use organic substrates composed of epoxy mold compound (EMC) created using a thermal compression process. EMC wafers are a cost-effective way to ...

Wittmann Battenfeld will show its newly developed injection-compression process called Hi-Q shaping in a demonstration of micro molding at the Medtec show in Stuttgart (Feb. 26 to 28). One of the ...

Shindo noncrimp fabrics (NCFs) have been used for various products in the aerospace, marine, civil construction, and repair and reinforcement fields. There are four features that characterize this new ...