The next generation of high-bandwidth memory, HBM4, was widely expected to require hybrid bonding to unlock a 16-high memory stack. A JEDEC move made that unnecessary with this generation, but it’s ...
TL;DR: SK hynix will showcase its AI memory technologies at CES 2025, featuring solutions for on-device AI and next-generation AI memories. The company aims to highlight its technological ...
Forbes contributors publish independent expert analyses and insights. This article discusses memory and chip and system design talks at the 2025 AI Infra Summit in Santa Clara, CA by Kove, Pliops and ...
Chip and silicon intellectual property technology company Rambus Inc. today announced HBM4E Memory Controller IP, a new solution that delivers breakthrough performance with advanced reliability ...
As SK hynix leads and Samsung lags, Micron positions itself as a strong contender in the high-bandwidth memory market for generative AI. Micron Technology (Nasdaq:MU) has started shipping samples of ...
Over the past two decades, the raw compute capability of processors used in high‑performance computing (HPC) and artificial intelligence (AI) systems has increased at an extraordinary pace. Figure 1 ...
Edge AI—enabling autonomous vehicles, medical sensors, and industrial monitors to learn from real-world data as it arrives—can now adopt learning models on the fly while keeping energy consumption and ...
China’s memory industry is no longer a distant follower. It is now fielding a pair of aggressive specialists that are starting to bite into the global market share long dominated by Samsung, Micron, ...
JEDEC’s HBM4 and the emerging SPHBM4 standard boost bandwidth and expand packaging options, helping AI and HPC systems push past the memory and I/O walls. Why AI and HPC compute scaling is outpacing ...
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