In this work, we propose a new signal routing method for solving routing problems that occur in the design process of semiconductor package substrates. Our work uses a topological transformation of ...

There are have been numerous papers written on the techniques that can be employed during integrated circuit (IC) design to achieve better overall manufacturability and yield. These ...

With process technologies evolving from 0.18 micron to 0.13 micron and on to 90 nanometers, signal integrity effects are strongly influencing the performance of integrated circuits. Two of the key ...

As the industry continues to press forward with 65-nm design starts and early production volumes, most of the buzz surrounding DFM has focused on the critical chip layers that form the transistor ...

The design teams typically invest years and numerous iterations to validate IP and produce a functioning chip. Once this validation is complete, they create derivatives of the silicon-proven IP, often ...